BT Resin PCB no ka IC-Substrate

ʻO ka papa PCB i hoʻohana ʻia i kēia manawa ma nā huahana SMD light-emitting diode no kahi ʻano PCB kūikawā a ʻo ia ka substrate IC maʻalahi. ʻO ka hōʻailona nui o ka substrate BT ma ka mākeke ʻo ka resin BT i hoʻomohala ʻia e Mitsubishi Gas, ʻo ka mea nui ʻo B (Bismaleimide) a me T (Triazine) i hui pū ʻia.
ʻO ka substrate i hana ʻia me ka resin BT he kiʻekiʻe Tg (255 ~ 330 ℃), ke kūpaʻa wela kiʻekiʻe (160 ~ 230 ℃), ka pale ʻana i ka wai, ka haʻahaʻa dielectric mau (Dk) a me ka nalowale dielectric (Df) a me nā pono ʻē aʻe. Hoʻohana nui ʻia ia i nā papa paʻi multilayer interconnect (HDI) a me nā substrates packaging.
ʻO nā kikoʻī mānoanoa nui o ka BT copper foil substrate he 0.10mm, 0.20mm, 0.40mm a me 0.46mm, a ʻo nā kikoʻī mānoanoa o ka pahu keleawe i uhi ʻia e ka BT copper foil substrate he 1/2oz a me 1/3oz, no laila ke kūlike BT papa pau mānoanoa huahana mea 0.18 +/- 0.03mm, 0.28+/- 0.03mm, 0.48+/- 0.03mm, 0.54+/- 0.03mm.
ʻO nā papa kaapuni BT o kēia manawa he mau papa ʻelua ʻaoʻao, hiki ke hoʻokaʻawale ʻia i nā papa drilled a me nā papa gong-groove e like me nā ʻano hana conduction. Wahi a ka mālama ʻana i ka ʻili, hiki ke hoʻokaʻawale ʻia i ʻelua mau ʻano: electroplating gula a me electroplating kālā, ma muli o ke kaʻina gula electroplating. Me ka hoʻohana ʻana i ke kaʻina kālā electroplating i ka papa BT, ua like ia me ka noi mākeke no ka kukui LED. Ua hoʻohana wale ʻia nā papa BT i loko o ka puʻupuʻu chip i ka hoʻomaka, a aia i kēia manawa ʻoi aku ka nui o nā ʻano ʻano he ʻumi. ʻO nā huahana ka nui o Anylayer, Substrate like pcbs (SLP) a me IC packaging substrates. ʻO ka helu kiʻekiʻe o nā papa a hiki i ka 12 papa. Hoʻohana ʻia nā huahana i nā mea kūʻai uila (e like me nā kelepona paʻa, nā mea hiki ke hoʻohana ʻia, ka papa, nā kāmela, nā puke puke, a me nā mea ʻē aʻe), ka Internet o nā mea, ka mana ʻoihana, ka uila uila, ʻoi aku ma mua o 100G communication optical module board a me nā māla ʻē aʻe.