Papa Kaapuni Pai Metala

ʻO nā hiʻohiʻona o Loaʻa ka hana hoʻoheheʻe wela maikaʻi i ka hoʻolālā kaapuni.
Hiki ke hoʻemi i ka mahana, hoʻomaikaʻi i ka mana a me ka hilinaʻi o nā huahana, hoʻolōʻihi i ke ola lawelawe o nā huahana;
Hiki ke ho'ēmi i ka leo, ho'ēmi i ka lako lako a me ka hui koina.
Hoʻohālikelike ʻia me ka substrate ceramic, ʻoi aku ka maikaʻi o ka hoʻomanawanui mechanical.
ʻO ka papa insulation thermal ka ʻenehana kumu o ka PCB alumini substrate. Hoʻokumu ʻia ia me nā polymers kūikawā i hoʻopiha ʻia me nā seramika kūikawā, ʻo ka max thermal conductivity o ka insulation layer he 8W/Mk, a ʻo ka thermal conductivity o ka thermoelectric separation substrate he 220-350W/mK.
ʻO ka papa waihona metala ka lālā kākoʻo o ka substrate aluminika, e koi ana i ka conductivity thermal kiʻekiʻe, ma ke ʻano he alumini substrate a me ka substrate keleawe (hiki i ka substrate keleawe ke hāʻawi i ka conductivity thermal maikaʻi loa), kūpono ia no ka wili, make stamping, gong plate, V- CUT, etc. Mea hana maʻamau.
Aluminum-based PCB copper clad laminate he mea metala kaapuni kaapuni, nona ke keleawe foil, thermal insulation layer a me metala substrate. Ua maheleia kona hale i ekolu papa:
Kaapuni kaapuni: Ua like ia me ka laminate keleawe aahu o PCB maʻamau, a ʻo ka mānoanoa o ka pepa keleawe kaapuni ʻo 1oz a 10oz.
ʻĀpana hoʻokaʻawale: He papa ia o nā mea hoʻoheheʻe thermally conductive me ke kūpaʻa haʻahaʻa haʻahaʻa. Mānoanoa: 0.003 "a 0.006" ʻīniha ka ʻenehana kumu o ka laminate keleawe i hoʻokumu ʻia i ka alumini.
Lamina lepo: He pani metala ia, ma ke ano he alumini me ka laminate aahu keleawe a i ole ka laminate keleawe ma ke keleawe, ka laminate keleawe ma ka hao.

He kiʻekiʻe ka PCB i hoʻokumu ʻia i ke keleawe, ʻoi aku ka maikaʻi o ka conductivity thermal ma mua o ka PCB i hoʻokumu ʻia i ka alumini a me ka PCB hao, kūpono no nā kaʻa kaʻa kiʻekiʻe a me nā wahi hoʻololi kiʻekiʻe a haʻahaʻa haʻahaʻa a me nā lako kamaʻilio a me nā huahana uila e pono ai ka maikaʻi. hoopau wela.
ʻO ke kumu keleawe PCB ʻāpana kaapuni me ka mana lawe nui o kēia manawa, pono e hoʻohana i ke keleawe keleawe mānoanoa, maʻamau 35 microns a 280 microns mānoanoa, ke kumu o ka thermal insulation material composition no ka 3 oxidation 2 alumini a me ka pauka silika a me ka epoxy resin i hoʻopiha ʻia i ka polymer composition, thermal. ʻuʻuku liʻiliʻi, hiki i ka viscoelastic maikaʻi, loaʻa ka mana o ka ʻelemakule wela, hiki ke kū i ke koʻikoʻi mechanical a me ka wela.
1, ʻO ka thermal conductivity o ke keleawe ma muli o ka PCB he pālua ia o ka PCB ma muli o ka alumini. ʻOi aku ka kiʻekiʻe o ka conductivity thermal, ʻoi aku ka kiʻekiʻe o ka hoʻokō wela a ʻoi aku ka maikaʻi o ka hana hoʻoheheʻe wela.
2, hiki ke hana ʻia ke kumu keleawe i loko o nā lua metallized, a ʻaʻole hiki i ke kumu alumini, ʻo ka pūnaewele o nā lua metallized e like me ka pūnaewele like, i hiki ai i ka hōʻailona ke hana grounding maikaʻi, a ʻo ke keleawe ponoʻī he weldable hana.
3, hiki ke hoʻopaʻa ʻia ke kumu keleawe o ka substrate keleawe i loko o nā kiʻi maikaʻi, ka hana ʻana i ka haku, hiki ke hoʻopili pono ʻia nā ʻāpana i ka luna, e hoʻokō i ka hopena maikaʻi loa a me ka hopena wela;
4, ma muli o ka ʻokoʻa o ka modulus elastic o ke keleawe a me ka alumini, ʻoi aku ka liʻiliʻi o ka warpage a me ka hoʻonui ʻana a me ka hoʻopaʻa ʻana o ka substrate keleawe ma mua o ka substrate alumini, a ʻoi aku ka paʻa o ka hana holoʻokoʻa.
5, ma muli o ke kumu keleawe mānoanoa, ʻo ka hoʻolālā ʻana o ka mea hana wili liʻiliʻi he 0.4mm, ka laulā laina laina e like me ka mānoanoa o ke keleawe keleawe ma ka substrate keleawe e hoʻoholo ai, ʻoi aku ka mānoanoa o ka mānoanoa keleawe, pono e hoʻoponopono. ʻoi aku ka laulā o ka laina, ʻoi aku ka nui o ka pono e hoʻoponopono i ka spacing liʻiliʻi.

noi:
Hoʻohana nui ʻia nā huahana i nā leo amplifiers, nā mana amplifiers, nā mea hoʻololi hoʻololi, nā mea hoʻololi DC/AC, nā mea hoʻokele kaʻa, nā mea hoʻoponopono uila, nā mana mana, nā modula mana kiʻekiʻe, kamaʻilio, mana, uila, automotive, lāʻau lapaʻau, lako automation, 3D Equipment, nā lako hale, nā kukui a me nā māla ʻē aʻe.