Papa Kaapuni Kaapuni Seramika
ʻO ka PCB kumu seramika e pili ana i ka hui pololei i ka foil keleawe i ka alumina wela kiʻekiʻe (Al2O3), ke alumini nitride (AlN) a me ka silicon nitride ceramic substrate (Si3N4) o ka papa hana kūikawā, me nā mea hana seramika substrate no kona ikaika kiʻekiʻe, maikaʻi loa. hana insulation, pale wela maikaʻi, liʻiliʻi thermal expansion coefficient o thermal conductivity, paʻa kemika maikaʻi, etc.
Ka Hana Hana
ʻO nā pōmaikaʻi o ka substrate ceramic
ʻOkoʻa mai ke aniani aniani FR4 substrate, ʻo ka mea seramika he hana kiʻekiʻe kiʻekiʻe a me ka hana uila, a he kiʻekiʻe ka thermal conductivity, chemical stability, maikaʻi thermal stability a me nā ʻano ʻē aʻe i loaʻa ʻole i nā substrates maʻamau.
● High thermal conductivity a me ke kiʻekiʻe wela kū'ē
● ʻOi aku ka liʻiliʻi o ka hoʻonui wela.
● ʻOi aku ka ikaika a me ka haʻahaʻa haʻahaʻa.
● Hana maikaʻi insulation.
● Haʻahaʻa kiʻekiʻe-frequency poho.
● Paʻa wela maikaʻi.
Nā hiʻohiʻona o ka substrate alumina:
● ʻO nā hiʻohiʻona maikaʻi o ka ili, hāʻawi i ka palahalaha maikaʻi a me ka palahalaha.
● Ke kū'ē kū'ē wela wela.
● ʻO ka ʻaila maikaʻi a me ka pale kemika.
● Warpage haʻahaʻa.
● Paʻa maikaʻi ma ke kaiapuni wela kiʻekiʻe.
● Hiki ke hana ʻia i nā ʻano paʻakikī like ʻole.
ʻO nā hiʻohiʻona o ka substrate nitride alumini:
● High thermal conductivity, ʻoi aku ma mua o 5 mau manawa o ka alumina.
● Haʻahaʻa haʻahaʻa o ka hoʻonui ʻana i ka wela, hiki ke hoʻemi maikaʻi i ke koʻikoʻi wela i hana ʻia e ka hoʻonui wela.
● Kiʻekiʻe uila insulation a me ka liʻiliʻi dielectric mau.
● Ka ikaika mechanical kiʻekiʻe a me ka nui.
● Kūleʻa maikaʻi i ka corrosion i ka metala hoʻoheheʻe.
● Haʻahaʻa dielectric poho a oi paʻa hilinaʻi.
Nā hiʻohiʻona o ka silicone nitride substrate:
● He kiʻekiʻe thermal conductivity
● Hoʻopili uila maikaʻi, paʻakikī kiʻekiʻe
● haʻahaʻa dielectric mau a me dielectric poho
● ʻO ka ikaika mechanical maikaʻi a me ke kū'ēʻana i ka haʻalulu
● ʻO ka hana anti-oxidation maikaʻi a me ka hana ʻino wela wela.
● Ka ikaika mechanical kiʻekiʻe a me ka nui.
'ikamu | Hana Hana Hana |
Kumu waiwai |
Aluminum kumu PCB, Cu kumu PCB, Fe base PCB, Ceramic PCB etc. Mea Kūikawā (5052,6061,6063) |
ʻIlikai ʻili | HASL, HASL L/F,ENIG,PlatingNi/Au,NiPdAu,Plating Sliver,Immersion Sliver, Immersion Tin,OSP,Flux |
No.o Layer | ʻO ka ʻaoʻao hoʻokahi, ʻaoʻao ʻelua, 4 papa Aluminum Base PCB |
Ka nui o ka papa | ka nui:1200*550MM / min:5*5MM |
Ka laula o ka mea alakai | 0.15MM / 0.15MM |
Warp and Twist | ≤0.75% |
Mānoanoa Papa | 0.6MM-6.0MM |
Mānoanoa keleawe | 35UM、70UM、105UM、140UM、210UM |
Noho Mānoanoa Hoʻomanawanui | ± 0.1MM |
Mānoanoa Pāpā keleawe | ≥18UM |
PTH Hole Dia.Hoʻomanawanui | ± 0.076MM |
NPTH hoʻomanawanui | ± 0.05MM |
Min.Hole Nui | 0.2mm |
Min. ʻAna o ka puka kī | 0.8MMM |
Min. Puni Slot Ana | 0.8MM * 0.8MM |
Hoʻokaʻawale Kūlana Puka | ± 0.076mm |
Hoʻomanawanui Outline | ± 10% |
V-ʻoki | 30 ° / 45 ° / 60 ° |
Min.BGA Pitch PAD | 20milā |
Min. moʻolelo ʻAno | 0.15MM |
Soldemask Layer Min.Bridge laula | 5milā |
Soldemask kiʻiʻoniʻoni Min.Thickness | 10milā |
Hoʻokaʻawale ʻokoʻa V-CUT | 5 Angular |
Mānoanoa Papa V-CUT | 0.6MM-3.2MM |
Voltage ho'āʻo E | 50-250V |
ʻAe ʻae | ε=2.1~10.0 |
Ke kaohi maʻamau | 0.8-8W/MK |
noi:
Nā kahua hoʻohana o ka papa kaapuni seramika alumina, ka papa kaapuni seramika alumina nitride a me ka papa kaapuni seramika nitride silicon:
ʻO nā mea uila kaʻa, kamaʻilio optoelectronic, nā antenna kamaʻilio, nā mea puhi kaʻa, nā modula semiconductor mana kiʻekiʻe, nā paneli lā, nā mea hoʻomehana uila, nā kaʻa mana mana, nā kaʻa hybrid mana, nā ʻāpana mana naʻauao, nā pākahi lithium, nā lako mana hoʻololi kiʻekiʻe, nā relay aupuni paʻa. , Aerospace, ka mana o ka ʻoihana, nā modula mana kaʻa, nā modula RF, nā mea lapaʻau, nā mea kūʻai uila, nā kukui LED kiʻekiʻe, ka transit rail, nā uila palekana, nā kaʻa ikehu hou a me nā ʻoihana ʻē aʻe he nui.