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Nui PCB Technology Co., Ltd.
PCB kiʻekiʻe

Taconic High-frequency PCB

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10 Layer High-frequency PCB

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ʻO Rogers-4350+FR4-TG170 Hybrid Structure PCB me ka mana impedance

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ʻO Arlon kiʻekiʻe-Frequency PCB

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PCB kiʻekiʻe

ʻO Rogers-5880+FR4-TG170 Hoʻolālā Hybrid HF PCB

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Loaʻa iā mākou kahi ʻenehana noiʻi ʻenehana kiʻekiʻe-frequency kiʻekiʻe a me ka hui hoʻomohala a me ka ʻike hana, maʻamau ka haʻahaʻa dielectric mau Dk, haʻahaʻa dissipation factor Df, a me ka coefficient haʻahaʻa o ka hoʻonui thermal CTE o ka papa kaapuni kiʻekiʻe kiʻekiʻe mau kumu waiwai, hāʻawi i ka kahe hōʻailona wikiwiki. no nā alapine a hiki i ka 100 GHz no ka home a me ka lawe ʻia ʻana o nā papa alapine kiʻekiʻe o nā kikoʻī like ʻole (FR4, F4B, TP-2, Rogers, TACONIC, ARLON, Isola, NELCO, Panasonic, TUC).

ninau
Ka Hana Hana

Inā makemake ʻoe e hōʻemi i nā kumukūʻai, ʻo FR4 ka mea liʻiliʻi, ʻoi aku ka nui o nā mea kūʻai aku no ka hana ʻana i nā PCB kiʻekiʻe. akā, ʻoi aku ka palena o ka hana kiʻekiʻe o FR4, hoʻohana maʻamau mākou i kēia mau mea maka hou i ka hana ʻana i nā PCB HF.
Nā Papa Kaapuni Kūikawā Paʻi Laminate maka:
ROGERS: RO3003, RO4003C, RO4350B, RO5880, RO4450B, etc.
TACONIC: TLC-30, TLE-95, RF-30, RF-35, TLY-5A, etc.
ARLON: 33N, 35N, 85N, 37N, 51N, HF-50, etc.
ISOLA: 370HR, 408HR, FR406, P95, P96, etc.
NELCO: N4000-6, N4000-12, N4000-13, N4000-13EPSI, etc.
Panasonic: Megtron4, Megtron6, etc.
TUC: TUC862, 872SLK, 883, 933. ect...

ʻO nā hiʻohiʻona kumu o nā mea substrate kiʻekiʻe e like me kēia:
(1) Pono ka liʻiliʻi a paʻa ka dielectric mau (Dk). ʻO ka maʻamau, ʻoi aku ka liʻiliʻi ʻoi aku ka maikaʻi, ʻoi aku ka maikaʻi o ka hoʻouna ʻana o ka hōʻailona ma ke ʻano like ʻole me ke kumu huinahā o ka dielectric mau o ka mea. Hiki ke hoʻopaneʻe ka hoʻouna ʻana i ka hōʻailona.
(2) Pono ka liʻiliʻi o ka dielectric loss (Df), e pili ana i ka maikaʻi o ka lawe ʻana i ka hōʻailona. ʻO ka liʻiliʻi o ka poho dielectric, ʻoi aku ka liʻiliʻi o ka nalowale hōʻailona.
(3) ʻO ke koena o ka hoʻonui wela o ka pahu keleawe e like me ka hiki, no ka mea, ʻo ka like ʻole e hoʻokaʻawale i ka pahu keleawe i ka wā o ka hoʻololi ʻana o ke anuanu a me ka wela.
(4) ʻO ka haʻahaʻa haʻahaʻa o ka wai a me ka wai kiʻekiʻe e hoʻopili i ka dielectric mau a me ka dielectric nalowale ke pulu.
(5) Pono e maikaʻi ke kūpaʻa wela ʻē aʻe, ka pale kemika, ka ikaika o ka hopena, ka ikaika ʻili, a me nā mea ʻē aʻe.
Ma ka ʻōlelo maʻamau, hiki ke wehewehe ʻia ke alapine kiʻekiʻe e like me ke alapine ma luna o 1GHz. I kēia manawa, ʻo ka mea maʻamau i hoʻohana pinepine ʻia i nā substrates kaapuni ʻo fluorine dielectric substrates, e like me polytetrafluoroethylene (PTFE), i kapa ʻia ʻo Teflon, i hoʻohana mau ʻia ma luna o 5GHz. Eia kekahi, hoʻohana pū ʻia ʻo FR-4, hiki ke hoʻohana ʻia no nā huahana ma waena o 1GHz a me 10GHz.

lunaʻenehana 'ikamu Ka hana hana
Material ʻAno FR-4,HIGH TG FR-4-TG170/TG180,CEM-3, Halogen- Free, Rogers, Arlon, Taconic, Isola, PTFE, Bergquist, Polyimide, Kumu Aluminum, Kumu keleawe, Pepa keleawe kaumaha
mānoanoa 0.2mm~10mm
IecaianoaaiiuoʻAno ʻIlikai ʻili HASL,HASL kepau-ole, HAL, Flash gula, gula immersion, OSP, Gold Finger Palting, Wae gula manoanoa koho, kala immersion, tin immersion, Carbon ink, peelable mask
No.o Layer 1L-56L
ʻOki Lamination Nui o ka Papa Hana Max:650mm×1200mm
Lapa loko Ka mānoanoa o loko 0.1 ~ 2.0mm
Ka laula o ka mea alakai Min:3/3mil
hoʻopololei 2.0milā
Ana Hoʻomanawanui Papa Mānoanoa ±10﹪
Ka hoʻolikelike ʻana ma waena ± 3milā
ʻO ka hoʻouluʻana ʻEli ana pakuhi Min: 0.15MM (Laser Drill:0.1MM)
PTH hoʻomanawanui ± 0.075mm
NPTH hoʻomanawanui ± 0.05mm
Hoʻomanawanui Kūlana Hole ± 0.076mm
PTH+Panel Plating Mānoanoa Pāpā keleawe ≥20um
Hoʻohui ≥90%
kēia lākiō hiʻohiʻona 12: 01
Papa waho Ka laula o ke alakai Min:3mil
Hoʻokaʻawale hoʻokele Min:3mil
Hoʻopalapala ʻano Mānoanoa keleawe i pau 1oz~10oz
ʻĀina Ma lalo o keʻoki ≥2.0
EING/FLASH GULA Mānoanoa Nickel ≥100u″
Mānoanoa gula 1~3u″
Palekana Solder mānoanoa 10~25um
Alahaka Palekana Solder 4milā
Puka Hole Dia 0.3 ~ 0.6mm
Kalai Makani Solder ʻOmaomao, ʻOmaomao maʻemaʻe, keʻokeʻo, keʻokeʻo ʻeleʻele, ʻeleʻele, ʻeleʻele ʻeleʻele, melemele, ʻulaʻula, ʻulaʻula, ʻīnika māmā
Waiho Silkscreen Keʻokeʻo, ʻeleʻele, melemele, ʻulaʻula, uliuli
Legend Laina Laulā/Lāina Moku 5/5mil
Manamana gula Mānoanoa Nickel ≥120u″
Mānoanoa gula 1~80u″
Papa Wela Kino mānoanoa 100-300u″
OSP Mānoanoa Membrane 0.2~0.4um
hoʻolele leo Ka hoomanawanui o ka Ana ± 0.1mm
Ka nui o ka slot Min: 0.6mm
Anawaena ʻoki 0.8mm-2.4mm
Punching Hoʻomanawanui Outline ± 0.1mm
Ka nui o ke kau Min: 0.7mm
V-OKI V-CUT Ana Min: 60mm
huina 15°30°45°
Noho Mānoanoa Hoʻomanawanui ± 0.1mm
ʻO ka beveling Anana Beveling 30-300mm
hōʻike Voltage ho'āʻo 250V
ʻO ka nui 540 × 400mm
Hoʻomalu Impedance ke ahonui, ± 10%
Ikaika Peel
1.4N / mm

noi:
ʻOiai ʻo ke alapine kiʻekiʻe o nā lako uila i kēia manawa he ʻano hoʻomohala, ʻoi aku ka nui o ka ulu ʻana o nā ʻupena uila a me nā kamaʻilio satelite, ke neʻe nei nā huahana ʻike i ka wikiwiki kiʻekiʻe a me ke alapine kiʻekiʻe, a ke neʻe nei nā huahana kamaʻilio i ka mana nui a me ka wikiwiki. ka hoʻoili leo, wikiō a me ka ʻikepili. ʻO ka standardization, no laila ke hoʻomohala ʻana i kahi hanauna hou o nā huahana e pono ai nā substrates kiʻekiʻe, a ʻo nā huahana kamaʻilio e like me nā ʻōnaehana ukali a me nā kelepona kelepona e loaʻa ai nā kahua kahua pono e hoʻohana i nā papa kaapuni kiʻekiʻe.
ʻO nā ʻoihana noiʻi: 5G antenna, telecommunication, base station, RF antenna, wireless local area network, terminal, satellite navigation, medical nuclear magnetic resonance, wireless charging, RFID, ETC, UAV, automotive radar, smart label and other fields.

KA NUI