PCB kiʻekiʻe
Loaʻa iā mākou kahi ʻenehana noiʻi ʻenehana kiʻekiʻe-frequency kiʻekiʻe a me ka hui hoʻomohala a me ka ʻike hana, maʻamau ka haʻahaʻa dielectric mau Dk, haʻahaʻa dissipation factor Df, a me ka coefficient haʻahaʻa o ka hoʻonui thermal CTE o ka papa kaapuni kiʻekiʻe kiʻekiʻe mau kumu waiwai, hāʻawi i ka kahe hōʻailona wikiwiki. no nā alapine a hiki i ka 100 GHz no ka home a me ka lawe ʻia ʻana o nā papa alapine kiʻekiʻe o nā kikoʻī like ʻole (FR4, F4B, TP-2, Rogers, TACONIC, ARLON, Isola, NELCO, Panasonic, TUC).
Ka Hana Hana
Inā makemake ʻoe e hōʻemi i nā kumukūʻai, ʻo FR4 ka mea liʻiliʻi, ʻoi aku ka nui o nā mea kūʻai aku no ka hana ʻana i nā PCB kiʻekiʻe. akā, ʻoi aku ka palena o ka hana kiʻekiʻe o FR4, hoʻohana maʻamau mākou i kēia mau mea maka hou i ka hana ʻana i nā PCB HF.
Nā Papa Kaapuni Kūikawā Paʻi Laminate maka:
ROGERS: RO3003, RO4003C, RO4350B, RO5880, RO4450B, etc.
TACONIC: TLC-30, TLE-95, RF-30, RF-35, TLY-5A, etc.
ARLON: 33N, 35N, 85N, 37N, 51N, HF-50, etc.
ISOLA: 370HR, 408HR, FR406, P95, P96, etc.
NELCO: N4000-6, N4000-12, N4000-13, N4000-13EPSI, etc.
Panasonic: Megtron4, Megtron6, etc.
TUC: TUC862, 872SLK, 883, 933. ect...
ʻO nā hiʻohiʻona kumu o nā mea substrate kiʻekiʻe e like me kēia:
(1) Pono ka liʻiliʻi a paʻa ka dielectric mau (Dk). ʻO ka maʻamau, ʻoi aku ka liʻiliʻi ʻoi aku ka maikaʻi, ʻoi aku ka maikaʻi o ka hoʻouna ʻana o ka hōʻailona ma ke ʻano like ʻole me ke kumu huinahā o ka dielectric mau o ka mea. Hiki ke hoʻopaneʻe ka hoʻouna ʻana i ka hōʻailona.
(2) Pono ka liʻiliʻi o ka dielectric loss (Df), e pili ana i ka maikaʻi o ka lawe ʻana i ka hōʻailona. ʻO ka liʻiliʻi o ka poho dielectric, ʻoi aku ka liʻiliʻi o ka nalowale hōʻailona.
(3) ʻO ke koena o ka hoʻonui wela o ka pahu keleawe e like me ka hiki, no ka mea, ʻo ka like ʻole e hoʻokaʻawale i ka pahu keleawe i ka wā o ka hoʻololi ʻana o ke anuanu a me ka wela.
(4) ʻO ka haʻahaʻa haʻahaʻa o ka wai a me ka wai kiʻekiʻe e hoʻopili i ka dielectric mau a me ka dielectric nalowale ke pulu.
(5) Pono e maikaʻi ke kūpaʻa wela ʻē aʻe, ka pale kemika, ka ikaika o ka hopena, ka ikaika ʻili, a me nā mea ʻē aʻe.
Ma ka ʻōlelo maʻamau, hiki ke wehewehe ʻia ke alapine kiʻekiʻe e like me ke alapine ma luna o 1GHz. I kēia manawa, ʻo ka mea maʻamau i hoʻohana pinepine ʻia i nā substrates kaapuni ʻo fluorine dielectric substrates, e like me polytetrafluoroethylene (PTFE), i kapa ʻia ʻo Teflon, i hoʻohana mau ʻia ma luna o 5GHz. Eia kekahi, hoʻohana pū ʻia ʻo FR-4, hiki ke hoʻohana ʻia no nā huahana ma waena o 1GHz a me 10GHz.
lunaʻenehana | 'ikamu | Ka hana hana | ||||||||||||
Material | ʻAno | FR-4,HIGH TG FR-4-TG170/TG180,CEM-3, Halogen- Free, Rogers, Arlon, Taconic, Isola, PTFE, Bergquist, Polyimide, Kumu Aluminum, Kumu keleawe, Pepa keleawe kaumaha | ||||||||||||
mānoanoa | 0.2mm~10mm | |||||||||||||
IecaianoaaiiuoʻAno | ʻIlikai ʻili | HASL,HASL kepau-ole, HAL, Flash gula, gula immersion, OSP, Gold Finger Palting, Wae gula manoanoa koho, kala immersion, tin immersion, Carbon ink, peelable mask | ||||||||||||
No.o Layer | 1L-56L | |||||||||||||
ʻOki Lamination | Nui o ka Papa Hana | Max:650mm×1200mm | ||||||||||||
Lapa loko | Ka mānoanoa o loko | 0.1 ~ 2.0mm | ||||||||||||
Ka laula o ka mea alakai | Min:3/3mil | |||||||||||||
hoʻopololei | 2.0milā | |||||||||||||
Ana | Hoʻomanawanui Papa Mānoanoa | ±10﹪ | ||||||||||||
Ka hoʻolikelike ʻana ma waena | ± 3milā | |||||||||||||
ʻO ka hoʻouluʻana | ʻEli ana pakuhi | Min: 0.15MM (Laser Drill:0.1MM) | ||||||||||||
PTH hoʻomanawanui | ± 0.075mm | |||||||||||||
NPTH hoʻomanawanui | ± 0.05mm | |||||||||||||
Hoʻomanawanui Kūlana Hole | ± 0.076mm | |||||||||||||
PTH+Panel Plating | Mānoanoa Pāpā keleawe | ≥20um | ||||||||||||
Hoʻohui | ≥90% | |||||||||||||
kēia lākiō hiʻohiʻona | 12: 01 | |||||||||||||
Papa waho | Ka laula o ke alakai | Min:3mil | ||||||||||||
Hoʻokaʻawale hoʻokele | Min:3mil | |||||||||||||
Hoʻopalapala ʻano | Mānoanoa keleawe i pau | 1oz~10oz | ||||||||||||
ʻĀina | Ma lalo o keʻoki | ≥2.0 | ||||||||||||
EING/FLASH GULA | Mānoanoa Nickel | ≥100u″ | ||||||||||||
Mānoanoa gula | 1~3u″ | |||||||||||||
Palekana Solder | mānoanoa | 10~25um | ||||||||||||
Alahaka Palekana Solder | 4milā | |||||||||||||
Puka Hole Dia | 0.3 ~ 0.6mm | |||||||||||||
Kalai Makani Solder | ʻOmaomao, ʻOmaomao maʻemaʻe, keʻokeʻo, keʻokeʻo ʻeleʻele, ʻeleʻele, ʻeleʻele ʻeleʻele, melemele, ʻulaʻula, ʻulaʻula, ʻīnika māmā | |||||||||||||
Waiho Silkscreen | Keʻokeʻo, ʻeleʻele, melemele, ʻulaʻula, uliuli | |||||||||||||
Legend | Laina Laulā/Lāina Moku | 5/5mil | ||||||||||||
Manamana gula | Mānoanoa Nickel | ≥120u″ | ||||||||||||
Mānoanoa gula | 1~80u″ | |||||||||||||
Papa Wela | Kino mānoanoa | 100-300u″ | ||||||||||||
OSP | Mānoanoa Membrane | 0.2~0.4um | ||||||||||||
hoʻolele leo | Ka hoomanawanui o ka Ana | ± 0.1mm | ||||||||||||
Ka nui o ka slot | Min: 0.6mm | |||||||||||||
Anawaena ʻoki | 0.8mm-2.4mm | |||||||||||||
Punching | Hoʻomanawanui Outline | ± 0.1mm | ||||||||||||
Ka nui o ke kau | Min: 0.7mm | |||||||||||||
V-OKI | V-CUT Ana | Min: 60mm | ||||||||||||
huina | 15°30°45° | |||||||||||||
Noho Mānoanoa Hoʻomanawanui | ± 0.1mm | |||||||||||||
ʻO ka beveling | Anana Beveling | 30-300mm | ||||||||||||
hōʻike | Voltage ho'āʻo | 250V | ||||||||||||
ʻO ka nui | 540 × 400mm | |||||||||||||
Hoʻomalu Impedance | ke ahonui, | ± 10% | ||||||||||||
Ikaika Peel | 1.4N / mm | |||||||||||||
noi:
ʻOiai ʻo ke alapine kiʻekiʻe o nā lako uila i kēia manawa he ʻano hoʻomohala, ʻoi aku ka nui o ka ulu ʻana o nā ʻupena uila a me nā kamaʻilio satelite, ke neʻe nei nā huahana ʻike i ka wikiwiki kiʻekiʻe a me ke alapine kiʻekiʻe, a ke neʻe nei nā huahana kamaʻilio i ka mana nui a me ka wikiwiki. ka hoʻoili leo, wikiō a me ka ʻikepili. ʻO ka standardization, no laila ke hoʻomohala ʻana i kahi hanauna hou o nā huahana e pono ai nā substrates kiʻekiʻe, a ʻo nā huahana kamaʻilio e like me nā ʻōnaehana ukali a me nā kelepona kelepona e loaʻa ai nā kahua kahua pono e hoʻohana i nā papa kaapuni kiʻekiʻe.
ʻO nā ʻoihana noiʻi: 5G antenna, telecommunication, base station, RF antenna, wireless local area network, terminal, satellite navigation, medical nuclear magnetic resonance, wireless charging, RFID, ETC, UAV, automotive radar, smart label and other fields.